Multi-chip packaging

ABSTRACT

An electronic device may include a first die that may include a first set of die contacts. The electronic device may include a second die that may include a second set of die contacts. The electronic device may include a bridge interconnect that may include a first set of bridge contacts and may include a second set of bridge contacts. The first set of bridge contacts may be directly coupled to the first set of die contacts (e.g., with an interconnecting material, such as solder). The second set of bridge contacts may be directly coupled to the second set of die contacts (e.g., with solder). The bridge interconnect may help facilitate electrical communication between the first die and the second die.

BACKGROUND

Electronic devices may include a plurality of integrated circuits. Theintegrated circuits may be in electrical communication through one ormore routing traces in a substrate. A die may be included in thesubstrate to help facilitate the electrical communication between theplurality of integrated circuits.

BRIEF DESCRIPTION OF THE DRAWINGS

In the drawings, which are not necessarily drawn to scale, like numeralsmay describe similar components in different views. Like numerals havingdifferent letter suffixes may represent different instances of similarcomponents. The drawings illustrate generally, by way of example, butnot by way of limitation, various embodiments discussed in the presentdocument.

FIG. 1 illustrates a schematic view of one example of an electronicdevice, in accordance with an example of the present subject matter.

FIG. 2 illustrates a schematic view of the electronic device during amanufacturing operation, in accordance with an example of the presentsubject matter.

FIG. 3 illustrates a schematic view of a bridge interconnect.

FIG. 4 illustrates a schematic view of the electronic device during amanufacturing operation, in accordance with an example of the presentsubject matter.

FIG. 5 illustrates a schematic view of the electronic device during amanufacturing operation, in accordance with an example of the presentsubject matter.

FIG. 6 illustrates a schematic view of the electronic device during amanufacturing operation, in accordance with an example of the presentsubject matter.

FIG. 7 illustrates a schematic view of the electronic device during amanufacturing operation, in accordance with an example of the presentsubject matter.

FIG. 8 illustrates a detailed schematic view of the electronic device100 at the circle 8-8 of FIG. 7, in accordance with an example of thepresent subject matter.

FIG. 9 illustrates a schematic view of the electronic device during amanufacturing operation, in accordance with an example of the presentsubject matter.

FIG. 10 illustrates a schematic view of the electronic device during amanufacturing operation, in accordance with an example of the presentsubject matter.

FIG. 11 illustrates a schematic view of the electronic device during amanufacturing operation, in accordance with an example of the presentsubject matter.

FIG. 12 illustrates a schematic view of the electronic device during amanufacturing operation, in accordance with an example of the presentsubject matter.

FIG. 13 illustrates a schematic view of the electronic device during amanufacturing operation, in accordance with an example of the presentsubject matter.

FIG. 14 illustrates a schematic view of the electronic device during amanufacturing operation, in accordance with an example of the presentsubject matter.

FIG. 15 illustrates a schematic view of the electronic device during amanufacturing operation, in accordance with an example of the presentsubject matter.

FIG. 16 illustrates a schematic view of the electronic device during amanufacturing operation, in accordance with an example of the presentsubject matter.

FIG. 17 illustrates a system level diagram, depicting an example of anelectronic system including the electronic device as described in thepresent disclosure.

FIG. 18 illustrates a method for manufacturing the electronic device.

DETAILED DESCRIPTION

The present inventors have recognized, among other things, that aproblem to be solved may include improving the electrical communicationbetween a plurality of die, such as by reducing the amount of signalloss or interference between the plurality of die. The present subjectmatter may help provide a solution to this problem, such as by providingan electronic device.

The electronic device may include a first die that may include a firstset of die contacts. The electronic device may include a second die thatmay include a second set of die contacts. The electronic device mayinclude a bridge interconnect that may include a first set of bridgecontacts and may include a second set of bridge contacts. The first setof bridge contacts may be directly coupled to the first set of diecontacts (e.g., with an interconnecting material, such as solder). Thesecond set of bridge contacts may be directly coupled to the second setof die contacts (e.g., with solder). The bridge interconnect may helpfacilitate electrical communication between the first die and the seconddie.

The bridge interconnect may help reduce the need to include a cavity ina substrate to accommodate a die to electrically interconnect the firstdie with the second die. The bridge interconnect may help reduce signalloss and interference between the first die and second die, such as byreducing the length a signal travels between the first die and thesecond die. The bridge interconnect may thereby help reducemanufacturing costs associated with manufacturing the electronic device,such as by improving manufacturing process yields or reducing complexityof manufacturing processes associated with fabricating the electronicdevice.

This overview is intended to provide an overview of subject matter ofthe present patent application. It is not intended to provide anexclusive or exhaustive explanation of the invention. The detaileddescription is included to provide further information about the presentpatent application.

FIG. 1 illustrates a schematic view of one example of an electronicdevice 100. The electronic device may include a first die 110, mayinclude a second die 120, and may include a third die 130. The first die110, the second die 120, or the third die 130 may include asemiconductor material. The first die 110, the second die 120, and thethird die 130 may include a processor die, a memory die, communicationdie (e.g., WiFi, Bluetooth, or cellular), or the like.

The electronic device 100 may include a bridge interconnect 140. Thebridge interconnect 140 may help facilitate electrical communicationwithin the electronic device 100, such as the electrical communicationbetween the first die 110 and the second die 120. The bridgeinterconnect 140 may be coupled with the first die 110, the second die120, and/or the third die 130, such as with an interconnection material(e.g., solder, electrically conductive epoxy, or the like) or withdirect bonding (e.g., bonding that includes intimate contact) of the dieand the bridge interconnect 140.

The electronic device 100 may include a molding material 150. Themolding material 150 may be coupled with (e.g., form a direct interfacewith, or encapsulate) a portion of the first die 110, the second die120, the third die 130, or may be coupled with a portion of the bridgeinterconnect 140. The molding material 150 may help provide mechanicalsupport to the electronic device 100. The molding material 150 mayinclude a filled polymer material. The molding material 150 may bedeposited, formed, injected, spun, or the like and thereby coupled withcomponents of the electronic device 100, such as the first die 110 orthe bridge interconnect 140.

The electronic device 100 may include a substrate 160. The substrate 160may include a dielectric material and may include a conductive material.The substrate 160 may include one or more routing layers that may beadapted to transmit electrical signals. The first die 110, the seconddie 120, and/or the third die 130 may be coupled to the substrate 160,such as with the interconnection material or with direct bonding of thedie and the substrate 160. The substrate 160 may be coupled to (and inelectrical communication with) additional structures (e.g., amotherboard, another substrate, a system on a chip, or the like). Theelectronic device 100 may include solder bumps 180 that may facilitatethe coupling of the substrate 160 with the additional structures. Thesolder bumps 180 may be in electrical communication with the routinglayers of the substrate 160.

An underfill material 170 may be positioned between the substrate 160and the bridge interconnect 140. The underfill material 170 may bedirectly adjacent to, or form a direct interface with, theinterconnection material. An oxide layer may be included between theunderfill 170 (or the molding material 150) and other components of theelectronic device 100, such as the interconnection material.

FIG. 2 illustrates a schematic view of the electronic device 100 duringa manufacturing operation, in accordance with an example of the presentsubject matter. As described herein, the electronic device 100 mayinclude the first die 110, the second die 120, and may include the thirddie 130. The first die 110, the second die 120, and the third die 130may be positioned on a carrier 200. An active side of the first die 110,the second die 120, and the third die 130 may be coupled to the carrier200. A non-active side of the first die 110, the second die 120, and thethird die 130 may be coupled to the carrier 200.

The carrier 200 may help provide a foundation for performingmanufacturing operations, such as manufacturing the electronic device100. The carrier 200 may provide a planar surface. The carrier 200 mayinclude a transparent material, such as glass, polymers, sapphire, orthe like. The carrier 200 may include a plurality of through-holes. Theplurality of through-holes may help couple the first die 110, the seconddie 120, and the third die 130 with the carrier 200. In an example, avacuum force is generated on a first side of the carrier 200 and appliedto the first die 110, the second die 120, and the third die 130positioned on a second side of the carrier 200.

The first die 110, the second die 120, and the third die 130 may becoupled to (e.g., affixed to, or held together with) the carrier 200,such as with an adhesive 210. The adhesive 210 may include a transparentmaterial. The adhesive 210 may have a thickness within a range of 10 to20 micrometers. The adhesive 210 may be adapted to release (e.g., thebonding forces between the first die 110 and the carrier 200 maydecrease) in response to heat or light (e.g., UV or visible light). Theadhesive 210 may be positioned between the active side of the first die110, the second die 120, and the third die 130; and the carrier 210.

The first die 110 may include a contact 220. The contact 220 may be inelectrical communication with circuitry of a die (e.g., the first die110), and may allow for the interconnection of the die with externaldevices or structures, including (but not limited to) the bridgeinterconnect 140. The contact 220 may include a conductive pad, aconductive bump, a conductive pin, a conductive pillar, or the like.

The first die 110 may include a first set of die contacts 230, a secondset of die contacts 240, and may include a third set of die contacts250. The second die 120 may include a fourth set of die contacts 260,and may include a fifth set of die contacts 270. The third die 110 mayinclude a sixth set of die contacts 280 and may include a seventh set ofdie contacts 290. The die contacts (e.g., the first set of die contacts230 and the fifth set of contacts 270) may extend from a die (e.g., thefirst die 110) and may have the same height, or may have varyingheights.

FIG. 3 illustrates a schematic view of the bridge interconnect 140. Asdiscussed in greater detail herein, the bridge interconnect 140 may helpfacilitate electrical communication between the first die 110, thesecond die 120, and/or the third die 130. The bridge interconnect 140may include a semiconductor die. The bridge interconnect 140 may processelectrical signals transmitted within the bridge interconnect 140. Thebridge interconnect 140 may include an organic package.

The bridge interconnect 140 may include a first set of bridge contacts310 and may include a second set of bridge contacts 320. The first setof bridge contacts 310 may include a bump 300. The bump 300 may be inelectrical communication with circuitry of the bridge interconnect 140and the bump 300 may extend from the bridge interconnect 140.

The bridge interconnect 140 may include a bridge via 350. The bridge via350 may include a through-silicon via. The bridge via 350 may helptransmit electrical signals through the bridge interconnect 140. Thebridge via 350 may electrically interconnect a first side 330 of thebridge interconnect 140 with a second side 340 of the bridgeinterconnect 140. The bridge interconnect 140 may include contacts(e.g., the first set of bridge contacts 310) on the first side 330 orthe second side 340 of the bridge interconnect 140. For example, thebridge interconnect 140 may include a first pad on the first side 330 ofthe bridge interconnect 140. The bridge interconnect 140 may include asecond pad on the second side 340 of the bridge interconnect 140. Thebump 300 may be coupled to the first pad or the second pad. The bridgevia 330 may be in electrical communication with the bump 300.

FIG. 4 illustrates a schematic view of the electronic device 100 duringa manufacturing operation, in accordance with an example of the presentsubject matter. The bridge interconnect 140 may help facilitateelectrical communication within the electronic device 100, such as theelectrical communication between the first die 110 and the third die130. The bridge interconnect 140 may help establish an electricalcommunication pathway between the first die 110, the second die 120, thethird die 130, and/or additional die of the electronic device 100. Thebridge interconnect 140 may be sized and shaped to overlap a portion ofthe first die 110 and the second die 120 (or the first die 110 and thethird die 130).

The bridge interconnect 140 may be directly coupled to the first die110, the second die 120, the third die 130, or additional die. Directlycoupling the bridge interconnect 140 may include directly bonding thebridge interconnect 140 with the first die 110, the second die 120,and/or the third die 130. In an example, the bridge interconnect 140includes a semiconductor die, and the die of the bridge interconnect 140is directly coupled to the first die 110. The bridge interconnect 140may be directly coupled to the first die 110 with an interconnectionmaterial 400 (e.g., solder, electrically conductive epoxy, or the like).

Because the bridge interconnect 140 is directly coupled with the die ofthe electronic device 100 (e.g., the first die 110), the bridgeinterconnect 140 may help reduce RC loss or may help reduce interconnectpropagation delay. In an example, the bridge interconnect 140 may helpreduce a length that an electrical signal must travel between the firstdie 110 and the second die 120. Additionally, the bridge interconnect140 may allow for the electrical signals to be transmitted at a greaterrate than, for instance, by transmitting the electrical signals throughrouting traces in a substrate.

Therefore, by directly coupling the bridge interconnect 140 with thefirst die 110 and the second die 120, the electrical signals that may betransmitted between the first die 110 and the second die 110 mayexperience a reduced amount of RC loss or interconnect propagationdelay. The bridge interconnect 140 may help improve performance of theelectronic device 100 and may help simplify the manufacturing process tomanufacture the electronic device 100.

Referring again to FIG. 4, the bridge contacts of the bridgeinterconnect 140 (for instance, the first set of bridge contacts 310 ofFIG. 3) may be directly coupled to the die contacts of the first die110, the second die 110, the third die 130, and/or additional die (e.g.,the first set of die contacts 230 and the fourth set of die contacts 260of FIG. 2). In an example, and as shown in FIG. 4, bridge contacts of afirst bridge interconnect 140A may be directly coupled to bridgecontacts the first die 110 and the second die 120 (e.g., with aninterconnect material, such as solder).

A second bridge interconnect 140B may be directly coupled to the firstdie 110 and the third die 130. The first bridge interconnect 140A mayhelp facilitate the electrical communication of the first die 110 andthe second die 120. The second bridge interconnect 140B may helpfacilitate the electrical communication between the first die 110 andthird die 130. The first bridge interconnect 140A and the second bridgeinterconnect 140B may help facilitate the electrical communicationbetween the second die 120 and the third die 130.

In another example, the bridge contacts of the first bridge interconnect140A may be directly coupled to the die contacts of the first die 110,the second die 120, and the third die 130. The first bridge interconnect140A may help facilitate the electrical communication between the firstdie 110, the second die 120, and the third die 130. In yet anotherexample, the first die 110, the second die, 120, the third die 130, anda fourth die are positioned proximate each other (e.g., arranged in agrid). The bridge contacts of the bridge interconnect 140A may bepositioned proximate the bridge contacts of the first die 110, thesecond die 120, the third die 130, and the fourth die (e.g., at the fourcorners of the die). The bridge interconnect 140A may be directlycoupled to the first die 110, the second die 120, the third die 130, andthe fourth die; and may help facilitate the electrical communicationbetween one or more of the first die 110, the second die 120, the thirddie 130, and the fourth die. Additional arrangements or configurationsof the first die 110, the second die 120, the third die 130, and/oradditional die; and bridge interconnects (e.g., the first bridgeinterconnect 140A and/or the second bridge interconnect 140B) arepossible and contemplated as being within the scope of the presentsubject matter.

The molding material 150 may be coupled to (e.g., deposited on, formedon, or the like) the electronic device 100. The molding material 150 maybe coupled to the first die 110, the second die 120, the third die 130,the bridge interconnect 140, and the interconnections of the electronicdevice 100. The molding material 150 may provide mechanical strength tothe electronic device 100 and may improve the resilience of theinterconnections of the electronic device 100.

FIG. 5 illustrates a schematic view of the electronic device 100 duringa manufacturing operation, in accordance with an example of the presentsubject matter. A first opening 500 or a second opening 510 may beformed in (e.g., defined in) the molding material 100, such as with alaser ablation process. The first opening 500 may be in communicationwith the contact 220 of the first die 110. The second opening 510 may bein communication with the fifth set of die contacts 270.

A fiducial mark may be used to align the first opening 500 with, forexample, the contact 220. As described herein, the carrier 200 mayinclude a transparent material. The carrier 200 may include one or morefiducial marks (a dot, a mark, a line, a geometric shape, an amorphousshape, or the like) that are used as a reference point to determine alocation of components of the electronic device 100 with respect to thecarrier 200. For example, a surface of the carrier 200 may include afiducial line that may be used to locate a position of the first die 110with respect to the carrier 200. The carrier 200 may be sized and shapeto include a plurality of die coupled to the surface of the carrier 200.The first die 110, the second die 120, and the third die 130 may becouple to the carrier 200 as a first set of die. The carrier 200 mayinclude fiducial marks that outline the area proximate the first die110, the second die 120, and the third die 130. A second set of die maybe coupled to the carrier 200. For example, the second set of die may becoupled to the carrier 200 in an adjacent unit cell to the first set ofdie, and the fiducial marks included in the carrier 200 may be used toidentify a location of the first set of die or a location of the secondset of die, with respect to the carrier 200.

Similarly, the first die 110, the second die 120, or the third die 130may include one or more fiducial marks. In an example, the first die 110may include a fiducial mark on the active side of the first die 110. Thecarrier 200 and the adhesive 210 may be transparent. The fiducial markon the active side of the first die 110 may be observed through thecarrier 200 and the adhesive 210. The fiducial mark on the active sideof the first die 110 may be used as a reference point in othermanufacturing processes for the electronic device 100, including (butnot limited to) ablating the molding material 150 to form the firstopening 500 or the second opening 510.

In another example, the one or more fiducial marks of the carrier 200may be positioned on a first surface of the carrier 200, and the one ormore fiducial marks may be observed through a second side of the carrier200. The one or more fiducial marks described herein may be used as areference point to determine a position of components of the electronicdevice 100, including (but not limited to), the third die 110, thecontact 220, or the fifth set of die contacts 270.

Referring again to FIG. 5, a conductive material (e.g., copper,aluminum, or the like) may be coupled to the electronic device 100,including (but not limited to) the molding material 150 or a contact(for instance, the contact 220). In an example, a conductive materialmay be deposited onto the electronic device 100, such as with a platingoperation (e.g., electrolytic plating or the like). The conductivematerial may fill the first opening 500 and the second opening 510. Thecoupling of the conductive material with the electronic device 100 mayform a layer of conductive material that covers the molding material150.

FIG. 6 illustrates a schematic view of the electronic device 100 duringa manufacturing operation, in accordance with an example of the presentsubject matter. As described herein, conductive material may be coupledto the electronic device 100. The conductive material may fill the firstopening 500 and may form a layer of conductive material that covers themolding material 150. As described in greater detail herein, theconductive material that fills the opening 500 (or the opening 510) mayprovide a die via 600.

The layer of conductive material (e.g., covering the molding material150) may be removed from the electronic device 100, such as with agrinding operation. The molding material 150 and the conductive materialmay be simultaneously removed and, as shown in FIG. 6, a first surface610 of the die via 600 may be coplanar with a second surface 620 of themolding material 150.

As described herein, the conductive material may be coupled with acontact (for instance, the contact 220 of FIG. 5) of the electronicdevice 100. The die via 600 may be coupled to the contact. The die via600 may help facilitate the electrical communication of the electronicdevice 100. In an example, the die via 600 provides an electricalcommunication pathway through the molding material 150 for the first die110. The electronic device 100 may include a plurality of die vias,including the die via 600.

Referring again to FIG. 6, a portion of the molding material 150 may beremoved from the electronic device 100, such as with a grindingoperation. A portion of the bridge interconnect 140 may be removed fromthe electronic device 100. The second surface 620 of the moldingmaterial 150 may be coplanar with a third surface 630 of the bridgeinterconnect 140, and may help reduce a height of the electronic device100. The third surface 630 of the bridge interconnect 140 may becoplanar with the first surface 610 of the die via 600 (e.g., a surfaceof the die via 600), and may help reduce a height of the electronicdevice 100.

The first die 110, the second die 120, and the third die 130 may besingulated as a unit 640 from the molding material 150. As describedherein, one or more sets of die (for instance the first set of diedescribed with reference to FIG. 5) may be coupled to the carrier 200(shown in FIG. 5). To remove the one or more set of die from the carrier200, the molding material 150 proximate the one or more sets of die maybe removed (e.g., cut or ablated, for instance with a laser). Forexample, the molding material 150 proximate a periphery of an areaoccupied by the first die 110, the second die 120, and the third die 130may be removed; and the first die 110, the second die 120, and the thirddie 130 may be separated as the unit 260 from a carrier (for instancethe carrier 200 of FIG. 5). As described in greater detail herein, theunit 640 may be used in additional manufacturing operations for theelectronic device 100.

FIG. 7 illustrates a schematic view of the electronic device 100 duringa manufacturing operation, in accordance with an example of the presentsubject matter. The electronic device 100 may include a substrate 150.As described herein, the substrate 160 may include one or more routinglayers that may be adapted to transmit electrical signals. The substrate160 may help facilitate the electrical communication of the first die110, the second die 120, and/or the third die 130.

In an example, the first die 110, the second die 120, and the third die130 may be coupled to the substrate 150. For instance, the unit 640 maybe coupled to the substrate 160. The substrate 160 may include substratecontacts (e.g., pads, bumps, pillars, pins, sockets, or the like) thatmay be in electrical communication with the routing layers of thesubstrate 160. The die via 600 that may be included in the electronicdevice 100 may be coupled to the substrate contacts, for instance withsolder bumps 710. Electrical signals may be transmitted from the firstdie 110, the second die 120, and/or the third die 130; through the dievia 600 and the solder bumps 710; and may propagate through thesubstrate 160 (and, for example, propagate through the solder bumps 180of FIG. 1).

FIG. 8 illustrates a detailed schematic view of the electronic device100 at the circle 8-8 of FIG. 7, in accordance with an example of thepresent subject matter. As described herein, the first die 110, thesecond die 120, or the third die 130 may be coupled to the substrate160. In some examples, the bridge interconnect 140 may be coupled to thesubstrate 160; and the bridge interconnect 140 may be in electricalcommunication with the substrate 160. The bridge interconnect 140 may bepositioned between the die of the electronic device (e.g., the first die110) and the substrate 160.

The bridge interconnect 140 may be coupled to the substrate 140. Forinstance, the bridge interconnect 140 may include bridge contacts on thefirst side 330 (shown in FIG. 3) of the bridge interconnect 140 (e.g.,the first set of bridge contacts 310 shown in FIG. 3). The bridgeinterconnect 140 may include bridge contacts on the second side of thebridge interconnect 140. For example, the bridge interconnect 140 mayinclude a third set of bridge contacts 810 on the second side of thebridge interconnect 140. The third set of bridge contacts 810 may becoupled to a first set of substrate contacts 820 of the substrate 160.The coupling of the bridge contacts (e.g., the third set of bridgecontacts 810) with the substrate contacts (e.g., the first set ofsubstrate contacts 820) may help facilitate the electrical communicationof the bridge interconnect 140 and the substrate 160.

The bridge interconnect 140 may include the bridge via 800 (or thebridge via 350 shown in FIG. 3). The bridge via 800 may help facilitatethe electrical communication between the die of the electronic device100 (e.g., first die 110) and the substrate 160. The bridge via 800 maybe a through-silicon via. The bridge via 800 may electricallyinterconnect a first side of the bridge interconnect (e.g., the firstside 330 shown in FIG. 3) with a second side of the bridge interconnect(e.g., the second side 340 shown in FIG. 3). The coupling of the bridgeinterconnect 140 with the substrate may allow for electrical signals tobe transmitted from a die of the electronic device (e.g., the second die120), through the bridge via 800, and transmitted to the substrate 160(e.g., by propagating the signals through the first set of substratecontacts 820).

Coupling the bridge interconnect 140 with substrate 160 may helpincrease the density of electrical interconnections in the electronicdevice. Coupling the bridge interconnect 140 with the substrate 160 mayprovide additional electrical communication pathways between the firstdie 110 and the substrate 110. For example, an electrical signal may betransmitted between the first die 110 and the substrate 160 within afootprint of the bridge interconnect 140. Increasing the density of theelectrical interconnections in the electronic device 100 may helpincrease the performance of the electronic device; or may allow fordimensions of the electronic device 100 to be reduced.

Additionally, coupling the unit 640 (shown in FIGS. 6 and 7) to thesubstrate 160 may help decrease the difficulty of manufacturing theelectronic device 100 and may help reduce losses in the manufacturingoperations for the electronic device 100.

In an example, the bridge interconnect 140 may include bridgeinterconnects (e.g., the first set of bridge interconnects 310 shown inFIG. 3) that have a first pitch. The first die 110 may include diecontacts that have the first pitch (e.g., the second set of die contacts240 shown in FIG. 2); and the first die 110 may include die contactsthat have a second pitch (e.g., the third set of die contacts 250 shownin FIG. 2). The first pitch may be different than the second pitch. Thestructures of the electronic device 100 that have the first pitch may beelectrically interconnected in a first operation. The structures of theelectronic device 100 that have the second pitch may be electricallyinterconnected in a second operation. Separating the interconnection ofthe structures with the first pitch and the second pitch into the firstoperation and the second operation may simplify the manufacturingoperations for the electronic device 100 and may help decrease waste(e.g., yield losses) associated with manufacturing operations for theelectronic device 100.

FIG. 9 illustrates a schematic view of the electronic device 100 duringa manufacturing operation, in accordance with an example of the presentsubject matter. One or more die, including (but not limited to); thefirst die 110, the second die 120, and the third die 130 may be coupledto the carrier 200 (e.g., with the adhesive layer 210). A first layer150A of the molding material 150 may be coupled to the first die 110,the second die 120, and the third die 130. The electronic device 100 mayinclude a die contact 900 (e.g., included in the third die 130), and thedie contact 900 may include a die contact surface 910. The die contactsurface 910 may be coplanar with a molding surface 920 of the firstlayer 150A of molding material 150.

FIG. 10 illustrates a schematic view of the electronic device 100 duringa manufacturing operation, in accordance with an example of the presentsubject matter. A layer 1000 may be coupled to the electronic device100. For example, the layer 1000 may be coupled to the die contactsurface 910 and the molding surface 920. A seam (e.g., difference inmetal grain structure) may be detectable (e.g., through non-destructiveevaluation) at the interface of the conductive material and the diecontact surface 910. The layer 1000 may include a conductive materialseed layer (e.g., copper) coupled to the electronic device 100. Thelayer 1000 may include a laminate material. The laminate material mayinclude (but is not limited to) dry film resist. The laminate materialmay be used in a manufacturing operation (e.g., photolithography or thelike) and may be photosensitive. The layer 1000 may harden (or soften)when exposed to light (e.g., UV light).

FIG. 11 illustrates a schematic view of the electronic device during amanufacturing operation, in accordance with an example of the presentsubject matter. As described herein, the layer 1000 may bephotosensitive. An opening 1100 may be formed in the layer 1000. Theopening 1100 may be in communication with the die contact surface 910.

In an example, a mask may be applied over the layer 1000, and the maskmay prevent portions of the layer 1000 from being exposed to light. Forexample, the mask may block the layer 1000 from absorbing light in thearea above the die contact surface 910. The unmasked portions of thelayer 1000 that absorb light may harden. The masked portion of the layer1000 may be removed (e.g., with a solvent), and the unmasked (orhardened) portions of the layer 1000 remain. The opening 1100 may bedefined in the layer 1000. For instance, the opening 1100 may be formedduring removal of the unmasked portions of the layer 1000 from theelectronic device 100.

A conductive material may be coupled to the electronic device 100, andthe conductive material may fill the opening 1100. The conductivematerial that fills the opening 1100 may create a conductive pillar(e.g., the conductive pillar 1200 shown in FIG. 12), and the conductivepillar may extend from a surface of a die (e.g., the first die 110). Theconductive material may be coupled to the die contact surface 910. Thelayer 1000 may be removed (e.g., dissolved) from the electronic device100, and the conductive material may be substantially unaffected by theremoval operation. The conductive pillar may include the conductivematerial that is coupled to the die contact surface 910 after theremoval of the layer 1000.

In an example, copper is plated into the opening 1100 and is coupledwith the die contact surface 910. The copper may be coplanar with a topsurface of the layer 1000. The layer 1000 may be removed (e.g., with asolvent) and the copper that filled the opening 1100 will remain coupledto the die contact surface 910.

FIG. 12 illustrates a schematic view of the electronic device 100 duringa manufacturing operation, in accordance with an example of the presentsubject matter. The electronic device 100 may include a conductivepillar 1200. The electronic device may include a plurality of conductivepillars that includes the conductive pillar 1200. The conductive pillar1200 may include conductive material (e.g., copper) that may be coupledto a die contact surface (e.g., the die contact surface 910 of FIG. 11)of a die (e.g., the second die 120). The conductive pillar 1200 may helpfacilitate the electrical communication of the die with externalstructures. For example, the conductive pillar 1200 may be coupled to asubstrate (e.g., the substrate 160 shown in FIG. 1), and the conductivepillar 1200 may help facilitate the electrical communication of the die(e.g., the first die 110) with the substrate.

As discussed herein, the electronic device 100 may include the bridgeinterconnect 140. The bridge interconnect 140 may be coupled to diecontacts (e.g., the first the electronic device 100 (e.g., first set ofdie contacts 230 and the fourth set of die contacts 260 shown in FIG.2), and the bridge interconnect may facilitate the electricalcommunication of the electronic device 100, including (but not limitedto) the electrical communication between the first die 110 and thesecond die 120. In some examples, the bridge interconnect 140 may becoupled to the electronic device 100 after the layer 1000 (shown inFIGS. 10-11) has been removed from the electronic device 100. The bridgeinterconnect 140 may be coplanar with a portion of the conductive pillar1200. The conductive pillar 1200 may have a first length and may extendfrom a die (e.g., the first die 110). The conductive pillar 1200 mayextend beyond the bridge interconnect 140 that is coupled to theelectronic device 100.

FIG. 13 illustrates a schematic view of the electronic device 100 duringa manufacturing operation, in accordance with an example of the presentsubject matter. As discussed herein, the electronic device 100 mayinclude the molding material 150. The molding material 150 may helpprovide mechanical strength to the electronic device 100. The moldingmaterial 150 may be coupled to the first die 110, the second die 120,the third die 130, the bridge interconnect 140, and may be coupled tothe conductive pillar 1200.

As described herein, the electronic device 100 may include the firstlayer 150A of the molding material 150. The electronic device 100 mayinclude a second layer 150B of the molding material 150. The first layer150A may be coupled to the electronic device 100 in a first operation,and the second layer 150B may be coupled to the electronic device 100 ina second operation. A seam (e.g., a discontinuity in molecularstructure) may be detectable at an interface of the first layer 150A andthe second layer 150B (e.g., through sectioning of, or non-destructiveevaluation of, the electronic device 100).

In an example, the electronic device includes a plurality of conductivepillars, and the molding material 150 may be positioned between theplurality of conductive pillars. The molding material 150 may bepositioned between the conductive pillar 1200 and the bridgeinterconnect 140. The molding material may be positioned between thebridge interconnect 140 and a die (e.g., the first die 110, the seconddie 120, or the third die 130). The molding material 150 may bepositioned between die contacts (e.g., the first set of die contacts 230shown in FIG. 2) and bridge contacts (e.g., the first set of bridgecontacts 310).

A portion of the molding material may be removed (e.g., in a grindingoperation) and a portion of the conductive pillar 1200 may be removed.The electronic device 100 may be removed from the carrier 200 as a unit(e.g., the unit 640 of FIGS. 6-7) and may be used in other manufacturingoperations. Portions of the molding material 150 may be removed from aperiphery of the electronic device 100.

FIG. 14 illustrates a schematic view of the electronic device 100 duringa manufacturing operation, in accordance with an example of the presentsubject matter. As described herein, the electronic device 100 mayinclude the first die 110, the second die 120, and the third die 130that may include the die contact 220. The molding material 150 may becoupled to the first die 110, the second die 120, and the third die 130.The die contact surface 910 of the die contact 220 may be coplanar withthe molding surface 920 of the molding material 150. The bridgeinterconnect 140 may be coupled to the electronic device 100 (e.g.,coupled to the first die 110 and the second die 120).

The electronic device 100 may be separated from a carrier (e.g., thecarrier 200 of FIG. 9) as the unit 640. The unit 640 may include one ormore die (e.g., the second die 120 and the third die 130). Excessportions 1400 of the molding material 150 may be removed (e.g., cut,ablated, or the like) from the unit 640. The molding surface 920 may becoplanar with a first surface 1410 (e.g., active side) of a die (e.g.,the third die 130). The molding surface 920 may be coplanar with asecond surface 1420 of the die. The first side 1410 of the die may beperpendicular to the second side of the die.

FIG. 15 illustrates a schematic view of the electronic device 100 duringa manufacturing operation, in accordance with an example of the presentsubject matter. The substrate 160 may include a conductive post 1510,and the conductive post 1510 may extend from a surface of the substrate160 (e.g., extend a first height). The unit 640 may be coupled to thesubstrate 160. For instance, a solder ball 1520 may be positionedbetween the die contact 220 and the conductive post 1510. The bridgeinterconnect 140 may be coplanar with a portion of the conductive post1510. The bridge interconnect 140 may be positioned between thesubstrate 160 and a die (e.g., the first die 110). In an example, theelectronic device 100 includes a first bridge interconnect (e.g., thebridge interconnect 140) and a second bridge interconnect; and the firstbridge interconnect may be coplanar with the second bridge interconnect.

As described herein, the electronic device 100 may include the underfillmaterial 170. The underfill material 170 may fill a space between theunit 640 and the substrate 160. In some examples, the underfill material170 has a lower viscosity than the molding material 150. The underfillmaterial 170 may be adapted to flow into spaces that the moldingmaterial 150 is unable to flow into (e.g., between the unit 640 and thesubstrate 160). The underfill material 170 may be coupled to the unit640, and may be coupled to the substrate 160. The underfill material 170may be positioned between the molding material 150 and the bridgeinterconnect 140. The underfill material 170 may be positioned betweenthe bridge contacts (e.g., the first set of bridge contacts 310 of FIG.3) of the bridge interconnect 140. The underfill material 170 may bepositioned between the bridge interconnect 140 and the conductive pillar1510. In an example, the bridge interconnect 140 may be positionedproximate the conductive pillar 1510, and the underfill material 170 mayfill a space between the bridge interconnect 140 and the conductivepillar 1510. The underfill material 170 may be coupled to the first die110, the second die 120, or the third die 130.

FIG. 16 illustrates a schematic view of the electronic device 100 duringa manufacturing operation, in accordance with an example of the presentsubject matter. The electronic device 100 may include a heat sink,including (but not limited to) an integrated heat spreader 1600. Theintegrated heat spreader 1600 may be positioned proximate the unit 640.An interface material 1610 (e.g., thermal interface material or thelike) may be positioned between the unit 640 and the integrated heatspreader 1600, and may improve heat transfer from a die (e.g., the firstdie 110) to the integrated heat spreader 1600. The interface material1610 may be positioned between the first side 1410 (shown in FIG. 15) ofa die (e.g., the third die 110) and the integrated heat spreader 1600.

FIG. 17 illustrates a system level diagram, depicting an example of anelectronic device (e.g., system) including the electronic device 100 asdescribed in the present disclosure. FIG. 17 is included to show anexample of a higher level device application for the electronic device100. In one embodiment, system 1700 includes, but is not limited to, adesktop computer, a laptop computer, a netbook, a tablet, a notebookcomputer, a personal digital assistant (PDA), a server, a workstation, acellular telephone, a mobile computing device, a smart phone, anInternet appliance or any other type of computing device. In someembodiments, system 1700 is a system on a chip (SOC) system.

In one embodiment, processor 1710 has one or more processor cores 1712and 1712N, where 1712N represents the Nth processor core insideprocessor 1710 where N is a positive integer. In one embodiment, system1700 includes multiple processors including 1710 and 1705, whereprocessor 1705 has logic similar or identical to the logic of processor1710. In some embodiments, processing core 1712 includes, but is notlimited to, pre-fetch logic to fetch instructions, decode logic todecode the instructions, execution logic to execute instructions and thelike. In some embodiments, processor 1710 has a cache memory 1716 tocache instructions and/or data for system 1700. Cache memory 1716 may beorganized into a hierarchal structure including one or more levels ofcache memory.

In some embodiments, processor 1710 includes a memory controller 1714,which is operable to perform functions that enable the processor 1710 toaccess and communicate with memory 1730 that includes a volatile memory1732 and/or a non-volatile memory 1734. In some embodiments, processor1710 is coupled with memory 1730 and chipset 1720. Processor 1710 mayalso be coupled to a wireless antenna 1778 to communicate with anydevice configured to transmit and/or receive wireless signals. In oneembodiment, an interface for wireless antenna 1778 operates inaccordance with, but is not limited to, the IEEE 802.11 standard and itsrelated family, Home Plug AV (HPAV), Ultra-Wide Band (UWB), Bluetooth,WiMax, or any form of wireless communication protocol.

In some embodiments, volatile memory 1732 includes, but is not limitedto, Synchronous Dynamic Random-Access Memory (SDRAM), Dynamic RandomAccess Memory (DRAM), RAMBUS Dynamic Random Access Memory (RDRAM),and/or any other type of random access memory device. Non-volatilememory 1734 includes, but is not limited to, flash memory, phase changememory (PCM), read-only memory (ROM), electrically erasable programmableread-only memory (EEPROM), or any other type of non-volatile memorydevice.

Memory 1730 stores information and instructions to be executed byprocessor 1710. In one embodiment, memory 1730 may also store temporaryvariables or other intermediate information while processor 1710 isexecuting instructions. In the illustrated embodiment, chipset 1720connects with processor 1710 via Point-to-Point (PtP or P-P) interfaces1717 and 1722. Chipset 1720 enables processor 1710 to connect to otherelements in system 1700. In some embodiments of the example system,interfaces 1717 and 1722 operate in accordance with a PtP communicationprotocol such as the Intel® QuickPath Interconnect (QPI) or the like. Inother embodiments, a different interconnect may be used.

In some embodiments, chipset 1720 is operable to communicate withprocessor 1710, 1705N, display device 1740, and other devices, includinga bus bridge 1772, a smart TV 1776, I/O devices 1774, nonvolatile memory1760, a storage medium (such as one or more mass storage devices) 1762,a keyboard/mouse 1764, a network interface 1766, and various forms ofconsumer electronics 1777 (such as a PDA, smart phone, tablet etc.),etc. In one embodiment, chipset 1720 couples with these devices throughan interface 1724. Chipset 1720 may also be coupled to a wirelessantenna 1778 to communicate with any device configured to transmitand/or receive wireless signals.

Chipset 1720 connects to display device 1740 via interface 1726. Display1740 may be, for example, a liquid crystal display (LCD), a plasmadisplay, cathode ray tube (CRT) display, or any other form of visualdisplay device. In some embodiments of the example system, processor1710 and chipset 1720 are merged into a single SOC. In addition, chipset1720 connects to one or more buses 1750 and 1755 that interconnectvarious system elements, such as I/O devices 1774, nonvolatile memory1760, storage medium 1762, a keyboard/mouse 1764, and network interface1766. Buses 1750 and 1755 may be interconnected together via a busbridge 1772.

In one embodiment, mass storage device 1762 includes, but is not limitedto, a solid-state drive, a hard disk drive, a universal serial bus flashmemory drive, or any other form of computer data storage medium. In oneembodiment, network interface 1766 is implemented by any type ofwell-known network interface standard including, but not limited to, anEthernet interface, a universal serial bus (USB) interface, a PeripheralComponent Interconnect (PCI) Express interface, a wireless interfaceand/or any other suitable type of interface. In one embodiment, thewireless interface operates in accordance with, but is not limited to,the IEEE 802.11 standard and its related family, Home Plug AV (HPAV),Ultra-Wide Band (UWB), Bluetooth, WiMax, or any form of wirelesscommunication protocol.

While the modules shown in FIG. 17 are depicted as separate blockswithin the system 1700, the functions performed by some of these blocksmay be integrated within a single semiconductor circuit or may beimplemented using two or more separate integrated circuits. For example,although cache memory 1716 is depicted as a separate block withinprocessor 1710, cache memory 1716 (or selected aspects of 1716) may beincorporated into processor core 1712.

FIG. 18 shows one example of a method 1800 for manufacturing anelectronic device, including one or more of the electronic device 100described herein. In describing the method 1800, reference is made toone or more components, features, functions and operations previouslydescribed herein. Where convenient, reference is made to the components,features, operations and the like with reference numerals. The referencenumerals provided are exemplary and are not exclusive. For instance,components, features, functions, operations and the like described inthe method 1800 include, but are not limited to, the correspondingnumbered elements provided herein and other corresponding elementsdescribed herein (both numbered and unnumbered) as well as theirequivalents.

At 1802, the method 1800 may include positioning a first die 110 on asurface of a carrier 200. The first die 110 may include a first set ofdie contacts (e.g., the first set of die contacts 230 shown in FIG. 2).

At 1804, the method 1800 may include positioning a second die 120 on thesurface of the carrier. The second die 120 may be positioned proximatethe first die 110 on the carrier 1200. The second die 120 may include asecond set of die contacts (e.g., the fourth set of die contacts 260shown in FIG. 2).

At 1806, the method 1800 may include positioning a first bridgeinterconnect 140A proximate the first die 110 and the second die 120.The first bridge interconnect 140A may include a first set of bridgecontacts 310 and may include a second set of bridge contacts 320.

At 1808, the method 1800 may include coupling the first set of bridgecontacts 310 with the first set of die contacts of the first die 110. At1810, the method 1800 may include coupling the second set of bridgecontacts 320 with the second set of die contacts of the second die 120.The method 1800 may include applying an electrically conductive epoxy tothe bridge contacts or the die contacts, for instance to directly couplea die (e.g., the first die 110) with the bridge interconnect 140.

The method 1800 may include positioning a third die 130 proximate thefirst die 120. The third die 130 may include a third set of die contacts(e.g., the sixth set of die contacts 280 shown in FIG. 2). The first die110 may include a fourth set of die contacts (e.g., the second set ofdie contacts 240 shown in FIG. 2).

The third die 130 may be positioned on a first side of the first die110, and the second die 120 may be positioned on a second side of thefirst die 110. The first side of the first die 110 may be opposite thesecond side of the first die 110. A fourth die may be positioned on athird side of the first die 110.Additional die (e.g., a fifth die) maybe positioned proximate the first die 110.

The method 1800 may include positioning a second bridge interconnect140B proximate the first die 110 and the third die 130. The secondbridge interconnect 140B may include a third set of set of bridgecontacts and a fourth set of bridge contacts. The method 1800 mayinclude coupling the third set of bridge contacts with the third set ofdie contacts. The method 1800 may include coupling the fourth set ofbridge contacts with the fourth set of die contacts. The first die 110and the third die 130 may be in electrical communication through thesecond bridge interconnect 140B.

The bridge interconnect 140 may facilitate the electrical communicationbetween two or more die. The method 1800 may include positioning thethird die 130 proximate the second die 120. In an example, a firstbridge interconnect 140A may be coupled to the first die 110 and thesecond die 120. A second bridge interconnect 140B may be coupled to thesecond die 120 and the third die 130. The third die 130 may communicatewith the first die 110, including (but not limited to), the third die130 communicating with the first die 110 by transmitting an electricalsignal through the first bridge interconnect 140 and the second bridgeinterconnect 140.

The method 1800 may include directly coupling a third set of bridgecontacts with the third set of die contacts (e.g., of the third die130). The bridge interconnect 140 may facilitate the electricalcommunication between the first die 110, the second die 120, and thethird die 130.

The method 1800 may include coupling a molding material 150 with thefirst die 110, the second die 120, or the bridge interconnect 140. Themethod 1800 may include forming (e.g., with an ablation operation) afirst opening (e.g., the first opening 500 shown in FIG. 5), and thefirst opening may be defined in the molding material 150. In an example,the carrier 200 (shown in FIG. 2) may include a transparent material. Adetector (e.g., a camera or the like) may examine fiducial marks from afirst side (e.g., bottom side) of the carrier 200. A removal apparatus(e.g., a laser) may be positioned proximate the molding material 150 (orthe electronic device 100). The removal apparatus may be positioned on asecond side (e.g., top side) of the carrier 200. The fiducial marks thatmay be observed from the first side of the carrier 200 may be referencedin positioning the removal apparatus. The fiducial marks may bereferenced, for example, to align the removal apparatus with a contact(e.g., the contact 220 of FIG. 2) of a die (e.g., the first die 110).The removal apparatus may form the opening by removing the moldingmaterial 150, and the opening may be aligned with a feature of theelectronic device 100 (e.g., the contact). The electronic device 100 mayinclude a second opening, and the second opening may expose a second diecontact.

The method 1800 may include forming a via (e.g., the first via 600 shownin FIG. 6) in the first opening by coupling a conductive material (e.g.,copper or the like) with the first opening and, for example, a contactof a die. The method 1800 may include removing a portion of the moldingmaterial 150 and the via (e.g., by removing material in a grindingoperation). A portion of the bridge interconnect may be removed (e.g.,ground) from the electronic device 100. The removal of the portions ofthe molding material 150, the via, and the bridge interconnect 140 maybe performed in the same operation (e.g., simultaneously grinding themolding material 150, the via, and the bridge interconnect 140).

The method 1800 may include coupling the first die 110 and the seconddie 120 with a substrate 160. The substrate 150 may help facilitate thecommunication of the first die 110 and the second die 120 with externalstructures (e.g., a motherboard or components of a system on a chip).

The method 1800 may include coupling a bridge interconnect via (e.g.,the bridge via 330 shown in FIG. 3) with the substrate 160. The bridgevia may be included in the bridge interconnect 140. The bridge via mayhelp establish an electrical communication pathway between the first die110 and the substrate 160. The method 1800 may include positioning anunderfill material between the bridge interconnect 140 and the substrate160.

VARIOUS NOTES & EXAMPLES

Aspect 1 may include or use subject matter (such as an apparatus, asystem, a device, a method, a means for performing acts, or a devicereadable medium including instructions that, when performed by thedevice, may cause the device to perform acts, or an article ofmanufacture), such as may include or use an electronic device.

The electronic device may include a first die. The first die may includea first set of die contacts. The electronic device may include a seconddie. The second die may include a second set of die contacts. Theelectronic device may include a bridge interconnect. The bridgeinterconnect may include a first set of bridge contacts and may includea second set of bridge contacts.

The first set of bridge contacts may be directly coupled to the firstset of die contacts, for instance with solder. The second set of bridgecontacts may be directly coupled to the second set of die contacts, forinstance with solder. The bridge interconnect may facilitate electricalcommunication between the first die and the second die.

Aspect 2 may include or use, or may optionally be combined with thesubject matter of Aspect 1, to optionally include or use that the bridgeinterconnect may include a third die. The third die may be sized andshaped to overlap a portion of the first die and to overlap a portion ofthe second die.

Aspect 3 may include or use, or may optionally be combined with thesubject matter of one or any combination of Aspects 1 or 2 to optionallyinclude or use that the first die and the second die may be inelectrical communication only through the bridge interconnect.

Aspect 4 may include or use, or may optionally be combined with thesubject matter of one or any combination of Aspects 1 through 3 tooptionally include or use a substrate. The first die and the second diemay be coupled to the substrate.

Aspect 5 may include or use, or may optionally be combined with thesubject matter of Aspect 4 to optionally include or use that the bridgeinterconnect may be positioned between the first die and the substrate.

Aspect 6 may include or use, or may optionally be combined with thesubject matter of Aspect 5 to optionally include or use an underfillmaterial that may be positioned between the bridge interconnect and thesubstrate.

Aspect 7 may include or use, or may optionally be combined with thesubject matter of Aspect 4 to optionally include or use a first bridgecontact. The first bridge contact may be positioned on a first surfaceof the bridge interconnect. The first bridge contact may be directlycoupled to a die contact of the first die, for instance with solder. Theelectronic device 100 may include a second bridge contact. The secondbridge contact may be positioned on a second surface of the bridgeinterconnect. The second bridge contact may be directly coupled to asubstrate contact of the substrate, for instance with solder.

The electronic device may include a bridge via. The bridge via may beincluded in the bridge interconnect. The bridge via may electricallyinterconnect the first bridge contact with the second bridge contact.The bridge via may facilitate the electrical communication between thefirst die and the substrate.

Aspect 8 may include or use, or may optionally be combined with thesubject matter of Aspect 7 to optionally include or use an underfillmaterial. The underfill material may form a direct interface with thesolder that may directly couple the second bridge contact with thesubstrate contact.

Aspect 9 may include or use, or may optionally be combined with thesubject matter of one or any combination of Aspects 1 through 8 tooptionally include or use that the first die and the second die may becoplanar.

Aspect 10 may include or use, or may optionally be combined with thesubject matter of one or any combination of Aspects 1 through 9 tooptionally include or use a molding material. The molding material mayform a direct interface with the first die, the second die, and thebridge interconnect.

Aspect 11 may include or use, or may optionally be combined with thesubject matter of Aspect 10 to optionally include or use a die via. Thedie via may be coupled with the first die. The die via may extendthrough the molding material.

Aspect 12 may include or use, or may optionally be combined with thesubject matter of Aspect 11 to optionally include or use that the bridgeinterconnect may be coplanar with a portion of the die via.

Aspect 13 may include or use, or may optionally be combined with thesubject matter of one or any combination of Aspects 11 or 12 tooptionally include or use that a surface of the bridge interconnect maybe coplanar with a surface of the molding material.

Aspect 14 may include or use, or may optionally be combined with thesubject matter of one or any combination of Aspects 1 through 13 tooptionally include or use a third set of die contacts. The third set ofdie contacts may be included in the first die. The electronic device mayinclude a die via. The die via may be coupled with the third set of diecontacts. The first set of die contacts may have a smaller dimensionthan the third set of die contacts.

Aspect 15 may include or use subject matter (such as an apparatus, asystem, a device, a method, a means for performing acts, or a devicereadable medium including instructions that, when performed by thedevice, may cause the device to perform acts, or an article ofmanufacture), such as may include or use an electronic device.

The electronic device may include a substrate. The electronic device mayinclude a first die. The first die may be coupled to the substrate. Thefirst die may include a first set of die contacts. The electronic devicemay include a second die. The second die may be coupled to thesubstrate. The second die may include a second set of die contacts.

The electronic device may include a first bridge interconnect. The firstbridge interconnect may be spaced from the substrate. The first bridgeinterconnect may include a first set of bridge contacts. The firstbridge interconnect may include a second set of bridge contacts. Thefirst set of bridge contacts may be directly coupled to the first set ofdie contacts, for instance with an interconnection material. The secondset of bridge contacts may be directly coupled to the second set of diecontacts, for instance with the interconnection material. The firstbridge interconnect may facilitate electrical communication between thefirst die and the second die.

Aspect 16 may include or use, or may optionally be combined with thesubject matter of Aspect 15, to optionally include or use that the firstbridge interconnect may be a third die.

Aspect 17 may include or use, or may optionally be combined with thesubject matter of one or any combination of Aspects 15 or 16 tooptionally include or use that the first die and the second die may bein electrical communication only through the first bridge interconnect.

Aspect 18 may include or use, or may optionally be combined with thesubject matter of one or any combination of Aspects 15 through 17 tooptionally include or use a third die. The third die may be coupled tothe substrate. The third die may include a third set of die contacts.The electronic device may include a fourth set of die contacts. Thefourth set of die contacts may be included in the second die.

The electronic device may include a second bridge interconnect. Thesecond bridge interconnect may be spaced from the substrate. The secondbridge interconnect may include a third set of bridge contacts and mayinclude a fourth set of bridge contacts. The third set of bridgecontacts may be directly coupled to the third set of die contacts, forinstance with the interconnection material. The fourth set of bridgecontacts may be directly coupled to the fourth set of die contacts, forinstance with the interconnection material. The second bridgeinterconnect may facilitate electrical communication between the seconddie and the third die.

Aspect 19 may include or use, or may optionally be combined with thesubject matter of Aspect 18 to optionally include or use that the firstbridge interconnect may be coplanar with the second bridge interconnect.

Aspect 20 may include or use, or may optionally be combined with thesubject matter of one or any combination of Aspects 15 through 19 tooptionally include or use a third die. The third die may be coupled tothe substrate. The third die may include a third set of die contacts.The electronic device may include a third set of bridge contacts. Thethird set of bridge contacts may be included in the first bridgeinterconnect. The third set of bridge contacts may be directly coupledto the third set of die contacts, for instance with the interconnectionmaterial. The first bridge interconnect may facilitate electricalcommunication between the first die, the second die, and the third die.

Aspect 21 may include or use subject matter (such as an apparatus, asystem, a device, a method, a means for performing acts, or a devicereadable medium including instructions that, when performed by thedevice, may cause the device to perform acts, or an article ofmanufacture), such as may include or use a method for manufacturing anelectronic device. The method may include positioning a first die on asurface of a carrier. The first die may include a first set of diecontacts.

The method may include positioning a second die on the surface of thecarrier. The second die may be positioned proximate (e.g., adjacent orthe like) the first die on the carrier. The second die may include asecond set of die contacts. The method may include positioning a firstbridge interconnect proximate the first die and the second die. Thefirst bridge interconnect may include a first set of bridge contacts anda second set of bridge contacts.

The method may include directly coupling the first set of bridgecontacts with the first set of die contacts of the first die. The methodmay include directly coupling the second set of bridge contacts with thesecond set of die contacts of the second die.

Aspect 22 may include or use, or may optionally be combined with thesubject matter of Aspect 21, to optionally include or use positioning athird die proximate the first die. The third die may include a third setof die contacts. The first die may include a fourth set of die contacts.The method may include positioning a second bridge interconnectproximate the first die and the third die. The second bridgeinterconnect may include a third set of set of bridge contacts and mayinclude a fourth set of bridge contacts. The method may include couplingthe third set of bridge contacts with the third set of die contacts. Themethod may include directly coupling the fourth set of bridge contactswith the fourth set of die contacts.

Aspect 23 may include or use, or may optionally be combined with thesubject matter of one or any combination of Aspects 21 or 22 tooptionally include or use coupling a molding material with the firstdie, the second die, and the first bridge interconnect.

Aspect 24 may include or use, or may optionally be combined with thesubject matter of Aspect 23 to optionally include or use forming a firstopening. The first opening may be defined in the molding material. Thefirst opening may expose a first die contact of the first die.

Aspect 25 may include or use, or may optionally be combined with thesubject matter of Aspect 24 to optionally include or use that thecarrier may include a transparent material. The forming of the firstopening may include examining fiducial marks from a first side of thetransparent carrier. The forming of the first opening may includepositioning a removal apparatus proximate the molding material on asecond side of the transparent carrier. Positioning the removalapparatus may include referencing the fiducial marks examined on thefirst side of the transparent carrier. The forming of the first openingmay include removing a portion of the molding material and forming thefirst opening.

Aspect 26 may include or use, or may optionally be combined with thesubject matter of one or any combination of Aspect 23 through 25 tooptionally include or use forming a second opening. The second openingmay be defined in the molding material. The second opening may expose asecond die contact of the second die.

Aspect 27 may include or use, or may optionally be combined with thesubject matter of one or any combination of Aspect 23 through 26 tooptionally include or use forming a via. The via may be formed in thefirst opening, for instance by coupling a conductive material with thefirst opening and the first contact of the first die.

Aspect 28 may include or use, or may optionally be combined with thesubject matter of one or any combination of Aspect 23 through 27 tooptionally include or use removing a portion of the molding material andthe via.

Aspect 29 may include or use, or may optionally be combined with thesubject matter of Aspect 28 to optionally include or use removing aportion of the bridge interconnect.

Aspect 30 may include or use, or may optionally be combined with thesubject matter of one or any combination of Aspects 21 through 29 tooptionally include or use that coupling the first set of bridge contactswith the first set of die contacts may include applying an electricallyconductive epoxy to the first set of bridge contacts or the first set ofdie contacts.

Aspect 31 may include or use, or may optionally be combined with thesubject matter of one or any combination of Aspects 21 through 30 tooptionally include or use coupling the first die and the second die witha substrate.

Aspect 32 may include or use, or may optionally be combined with thesubject matter of Aspect 31 to optionally include or use coupling abridge via with the substrate. The bridge via may be included in thebridge interconnect. The bridge via may establish an electricalcommunication pathway between the first die and the substrate.

Aspect 33 may include or use, or may optionally be combined with thesubject matter of one or any combination of Aspects 31 or 32 tooptionally include or use positioning an underfill material between thebridge interconnect and the substrate.

Aspect 34 may include or use, or may optionally be combined with anyportion or combination of any portions of any one or more of Aspects 1through 33 to include or use, subject matter that may include means forperforming any one or more of the functions of Aspects 1 through 33, ora machine-readable medium including instructions that, when performed bya machine, cause the machine to perform any one or more of the functionsof Aspects 1 through 33.

Each of these non-limiting examples may stand on its own, or may becombined in various permutations or combinations with one or more of theother examples.

The above description includes references to the accompanying drawings,which form a part of the detailed description. The drawings show, by wayof illustration, specific embodiments in which the invention may bepracticed. These embodiments are also referred to herein as “examples.”Such examples may include elements in addition to those shown ordescribed. However, the present inventors also contemplate examples inwhich only those elements shown or described are provided. Moreover, thepresent inventors also contemplate examples using any combination orpermutation of those elements shown or described (or one or more aspectsthereof), either with respect to a particular example (or one or moreaspects thereof), or with respect to other examples (or one or moreaspects thereof) shown or described herein.

In the event of inconsistent usages between this document and anydocuments so incorporated by reference, the usage in this documentcontrols.

In this document, the terms “a” or “an” are used, as is common in patentdocuments, to include one or more than one, independent of any otherinstances or usages of “at least one” or “one or more.” In thisdocument, the term “or” is used to refer to a nonexclusive or, such that“A or B” includes “A but not B,” “B but not A,” and “A and B,” unlessotherwise indicated. In this document, the terms “including” and “inwhich” are used as the plain-English equivalents of the respective terms“comprising” and “wherein.” Also, in the following claims, the terms“including” and “comprising” are open-ended, that is, a system, device,article, composition, formulation, or process that includes elements inaddition to those listed after such a term in a claim are still deemedto fall within the scope of that claim. Moreover, in the followingclaims, the terms “first,” “second,” and “third,” etc. are used merelyas labels, and are not intended to impose numerical requirements ontheir objects.

Geometric terms, such as “parallel”, “perpendicular”, “round”, or“square”, are not intended to require absolute mathematical precision,unless the context indicates otherwise. Instead, such geometric termsallow for variations due to manufacturing or equivalent functions. Forexample, if an element is described as “round” or “generally round,” acomponent that is not precisely circular (e.g., one that is slightlyoblong or is a many-sided polygon) is still encompassed by thisdescription.

Method examples described herein may be machine or computer-implementedat least in part. Some examples may include a computer-readable mediumor machine-readable medium encoded with instructions operable toconfigure an electronic device to perform methods as described in theabove examples. An implementation of such methods may include code, suchas microcode, assembly language code, a higher-level language code, orthe like. Such code may include computer readable instructions forperforming various methods. The code may form portions of computerprogram products. Further, in an example, the code may be tangiblystored on one or more volatile, non-transitory, or non-volatile tangiblecomputer-readable media, such as during execution or at other times.Examples of these tangible computer-readable media may include, but arenot limited to, hard disks, removable magnetic disks, removable opticaldisks (e.g., compact disks and digital video disks), magnetic cassettes,memory cards or sticks, random access memories (RAMs), read onlymemories (ROMs), and the like.

The above description is intended to be illustrative, and notrestrictive. For example, the above-described examples (or one or moreaspects thereof) may be used in combination with each other. Otherembodiments may be used, such as by one of ordinary skill in the artupon reviewing the above description. The Abstract is provided to complywith 37 C.F.R. § 1.72(b), to allow the reader to quickly ascertain thenature of the technical disclosure. It is submitted with theunderstanding that it will not be used to interpret or limit the scopeor meaning of the claims. Also, in the above Detailed Description,various features may be grouped together to streamline the disclosure.This should not be interpreted as intending that an unclaimed disclosedfeature is essential to any claim. Rather, inventive subject matter maylie in less than all features of a particular disclosed embodiment.Thus, the following claims are hereby incorporated into the DetailedDescription as examples or embodiments, with each claim standing on itsown as a separate embodiment, and it is contemplated that suchembodiments may be combined with each other in various combinations orpermutations. The scope of the invention should be determined withreference to the appended claims, along with the full scope ofequivalents to which such claims are entitled.

1. An electronic device, comprising: a first die including a first setof die contacts; a second die including a second set of die contacts; abridge interconnect including a first set of bridge contacts and asecond set of bridge contacts; and wherein the first set of bridgecontacts are directly coupled to the first set of die contacts withsolder, the second set of bridge contacts are directly coupled to thesecond set of die contacts with solder, and the bridge interconnectfacilitates electrical communication between the first die and thesecond die.
 2. The electronic device of claim 1, wherein the bridgeinterconnect is a third die, and the third die is sized and shaped tooverlap a portion of the first die and to overlap a portion of thesecond die.
 3. The electronic device of claim 1, wherein the first dieand the second die are in electrical communication only through thebridge interconnect.
 4. The electronic device of claim 1, furthercomprising a substrate, wherein the first die and the second die arecoupled to the substrate.
 5. The electronic device of claim 4, whereinthe bridge interconnect is positioned between the first die and thesubstrate.
 6. The electronic device of claim 4, further comprising: afirst bridge contact positioned on a first surface of the bridgeinterconnect, wherein the first bridge contact is directly coupled to adie contact of the first die with solder; a second bridge contactpositioned on a second surface of the bridge interconnect, wherein thesecond bridge contact is directly coupled to a substrate contact of thesubstrate with solder; a bridge via included in the bridge interconnect,wherein the bridge via electrically interconnects the first bridgecontact with the second bridge contact; and wherein the bridge viafacilitates the electrical communication between the first die and thesubstrate.
 7. The electronic device of claim 1, wherein the first dieand the second die are coplanar.
 8. The electronic device of claim 1,further comprising a molding material, wherein the molding materialforms a direct interface with the first die, the second die, and thebridge interconnect.
 9. The electronic device of claim 8, furthercomprising a die via, wherein the die via is coupled with the first dieand the die via extends through the molding material.
 10. The electronicdevice of claim 9, wherein the bridge interconnect is coplanar with aportion of the die via.
 11. The electronic device of claim 1, furthercomprising: a third set of die contacts included in the first die; a dievia coupled with the third set of die contacts; and wherein the firstset of die contacts has a smaller dimension than the third set of diecontacts.
 12. An electronic device, comprising: a substrate; a first diecoupled to the substrate, the first die including a first set of diecontacts; a second die coupled to the substrate, the second dieincluding a second set of die contacts; a first bridge interconnectspaced from the substrate, the first bridge interconnect including afirst set of bridge contacts and a second set of bridge contacts; andwherein the first set of bridge contacts are directly coupled to thefirst set of die contacts with an interconnection material, the secondset of bridge contacts are directly coupled to the second set of diecontacts with the interconnection material, and the first bridgeinterconnect facilitates electrical communication between the first dieand the second die.
 13. The electronic device of claim 12, wherein thefirst bridge interconnect is a third die.
 14. The electronic device ofclaim 12, wherein the first die and the second die are in electricalcommunication only through the first bridge interconnect.
 15. Theelectronic device of claim 12, further comprising: a third die coupledto the substrate, the third die including a third set of die contacts; afourth set of die contacts included in the second die; a second bridgeinterconnect spaced from the substrate, the second bridge interconnectincluding a third set of bridge contacts and a fourth set of bridgecontacts; and wherein the third set of bridge contacts are directlycoupled to the third set of die contacts with the interconnectionmaterial, the fourth set of bridge contacts are directly coupled to thefourth set of die contacts with the interconnection material, and thesecond bridge interconnect facilitates electrical communication betweenthe second die and the third die.
 16. The electronic device of claim 12,further comprising: a third die coupled to the substrate, the third dieincluding a third set of die contacts; and a third set of bridgecontacts included in the first bridge interconnect, wherein: the thirdset of bridge contacts are directly coupled to the third set of diecontacts with the interconnection material, and the first bridgeinterconnect facilitates electrical communication between the first die,the second die, and the third die.
 17. A method for manufacturing anelectronic device, comprising: positioning a first die on a surface of acarrier, wherein the first die includes a first set of die contacts;positioning a second die on the surface of the carrier, wherein thesecond die is positioned proximate the first die on the carrier and thesecond die includes a second set of die contacts; positioning a firstbridge interconnect proximate the first die and the second die, whereinthe first bridge interconnect includes a first set of bridge contactsand a second set of bridge contacts; directly coupling the first set ofbridge contacts with the first set of die contacts of the first die; anddirectly coupling the second set of bridge contacts with the second setof die contacts of the second die.
 18. The method of claim 17, furthercomprising: positioning a third die proximate the first die, wherein thethird die includes a third set of die contacts and the first dieincludes a fourth set of die contacts; positioning a second bridgeinterconnect proximate the first die and the third die, wherein thesecond bridge interconnect includes a third set of set of bridgecontacts and a fourth set of bridge contacts; coupling the third set ofbridge contacts with the third set of die contacts; and directlycoupling the fourth set of bridge contacts with the fourth set of diecontacts.
 19. The method of claim 17, further comprising coupling amolding material with the first die, the second die, and the firstbridge interconnect.
 20. The method of claim 19, further comprisingforming a first opening that is defined in the molding material, andexposing a first die contact of the first die.
 21. The method of claim20, wherein the carrier includes a transparent material, and forming thefirst opening includes: examining fiducial marks from a first side ofthe transparent carrier; positioning a removal apparatus proximate themolding material on a second side of the transparent carrier, whereinpositioning the removal apparatus includes referencing the fiducialmarks examined on the first side of the transparent carrier; andremoving a portion of the molding material and forming the firstopening.
 22. The method of claim 19, further comprising forming a via inthe first opening by coupling a conductive material with the firstopening and the first contact of the first die.
 23. The method of claim17, wherein coupling the first set of bridge contacts with the first setof die contacts includes applying an electrically conductive epoxy tothe first set of bridge contacts or the first set of die contacts. 24.The method of claim 17, further comprising coupling the first die andthe second die with a substrate.
 25. The method of claim 24, furthercomprising coupling a bridge via with the substrate, wherein the bridgevia is included in the bridge interconnect, and the bridge viaestablishes an electrical communication pathway between the first dieand the substrate.